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(163 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 CONGA-B7XD/HSP-CU-BHeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-B | 재고 | - | |
 CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-QA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-TS170/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA3/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are 2.7mm bore hole. | 재고 | - | |
CONGA-B7XD/HSP-CU-THeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-T | 재고 | - | |
 CONGA-QMX6/HSP3-THeat Sinks | congatec | Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5. | 154 | - | |
 CONGA-B7XD/HSP-VC-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express Type 7 module conga-B7XD with integrated vapor chamber. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-QA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-QA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-TCA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-TC570/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. | 재고 | - |
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