방열판

(163 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
congatec_CONGA-PA7/I-HSP-B
congatec Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are with 2.7mm borehole
재고
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congatec Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread.
재고
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congatec_CONGA-QA5/I-HSP-T
congatec Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.
재고
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congatec_CONGA-MA5/I-CSP-B
congatec Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.
1
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congatec_HPC/SILH-HSP-HP-B
congatec Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.
재고
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congatec_CONGA-QA3/HSP-T

CONGA-QA3/HSP-T

Heat Sinks
congatec Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm
재고
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congatec_CONGA-QA5/HSP-B

CONGA-QA5/HSP-B

Heat Sinks
congatec Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.
재고
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congatec_TCV2/HSP-HP-T

TCV2/HSP-HP-T

Heat Sinks
congatec Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread.
재고
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congatec_CONGA-UMX6/HSP3-B
congatec Heat Sinks Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants.
재고
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congatec_CONGA-QMX6/HSP3-T
congatec Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5.
154
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congatec_CONGA-QA5/CSP-T

CONGA-QA5/CSP-T

Heat Sinks
congatec Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
재고
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congatec_CONGA-QA5/HSP-T

CONGA-QA5/HSP-T

Heat Sinks
congatec Heat Sinks Standard heatspreader for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
재고
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congatec_CONGA-TCA7/HSP-B

CONGA-TCA7/HSP-B

Heat Sinks
congatec Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.
재고
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