전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
CONGA-TC370/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | 재고 | - | |
CONGA-MA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
SMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-QMX6/HSP2-THeat Sinks | congatec | Heat Sinks STANDARD HEAT SPREADER QMX6 2MM | 재고 | - | |
CONGA-TCA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-HPC/CTLU-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 1 | - | |
HPC/CALS-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-PA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are with 2.7mm borehole | 재고 | - | |
CONGA-HPC/CTLU-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | 재고 | - | |
CONGA-SA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TS170/CSA-HP-BHeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA3/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread. | 재고 | - | |
JC370/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm. | 재고 | - | |
CONGA-TCR8/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | 재고 | - | |
TCV2/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
TC670/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-MA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 23 | - | |
CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-JC370/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (threaded). Total height 12mm. | 재고 | - | |
CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-HPC/CTLH-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | 재고 | - |