heat-sinks - heat-sinks - Ersa Electronics

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RFQ

부분 #	제조업체	설명	유효성	가격
015190 Heat Sinks	congatec	Heat Sink Spreader	재고	-
015536 Heat Sinks	congatec	Standard Heat spreader for Qseven Module conga-QA5 with Open Silicon Pentium and Celeron processor	재고	-
048053 Heat Sinks	congatec	Standard Heat Spreader for COM Express Mini Type10 module conga-MA5 with lidded Atom processor	재고	-
047532 Heat Sinks	congatec	Standard Heat Spreader for High Performance COM Express Type 7 Module with integrated vapor chamber. All standoffs are M2.5mm thread	재고	-
15192 Heat Sinks	congatec	Standard Heat Spreader	재고	-
CONGA-PA7/HSP-B Heat Sinks	congatec	Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm borehole	1	-
CONGA-B7E3/SP4-HSP-HP-B Heat Sinks	congatec	Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all dual die die variants.	재고	-
CONGA-JC370/HSP-B Heat Sinks	congatec	Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm.	재고	-
B7XI/HSP-HP-B Heat Sinks	congatec	Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm.	재고	-
SMX8-X/I-HSP-B Heat Sinks	congatec	Heat Sinks Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.	21	-
CONGA-TCA5/CSP-B Heat Sinks	congatec	Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole.	재고	-
HPC/CALS-HSP-HP-T Heat Sinks	congatec	Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded.	재고	-
CONGA-MA5/I-CSP-T Heat Sinks	congatec	Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread.	2	-
CONGA-QA5/I-CSP-B Heat Sinks	congatec	Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole.	재고	-
CONGA-STDA4/CSP-BCONGA-STDA4/CSP-B Heat Sinks	congatec	Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM Jacinto 7 ARM	재고	-
CONGA-QMX8/HSP-B Heat Sinks	congatec	Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.	재고	-
CONGA-MA3/CSP-T Heat Sinks	congatec	Heat Sinks Standard passive cooling solution for COM Express Type 10 modules conga-MA3 and MA3E with fins. All standoffs are M2.5mm thread.	재고	-
CONGA-PA7/I-HSP-T Heat Sinks	congatec	Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are M2.5 thread.	2	-
CONGA-TC700/HSP-HP-T Heat Sinks	congatec	Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded.	재고	-
CONGA-MA3/HSP-T Heat Sinks	congatec	Heat Sinks Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread.	재고	-
CONGA-TCA5/HSP-T Heat Sinks	congatec	Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.	재고	-
CONGA-B7E3/HSP-HP-B Heat Sinks	congatec	Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are bore hole. Suitable for all single die variants.	재고	-
CONGA-MA7/HSP-B Heat Sinks	congatec	Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with open-die Intel Pentium/Celeron N and J processors. All standoffs are with 2.7mm bore hole.	재고	-
CONGA-PA7/I-HSP-B Heat Sinks	congatec	Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are with 2.7mm borehole	재고	-
CONGA-QA3/CSP-T Heat Sinks	congatec	Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are M2.5mm thread.	재고	-