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(163 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 CONGA-MA3/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Type 10 modules conga-MA3 and MA3E. All standoffs are M2.5 thread. | 재고 | - | |
 CONGA-TCA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-PA7/HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors . All standoffs are M2.5 thread. | 재고 | - | |
 CONGA-TC570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-MA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 B7XI/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | 재고 | - | |
ICX/CSPHeat Sinks | congatec | Heat Sinks Passive cooling for conga-IC87/IC97/IC170/IC175, 85L*85W*27H (mm) / 165 g, Aluminum, to be used with conga-ICx/Retention Frame PN 052254. | 재고 | - | |
 CONGA-B7E3/SP4-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all dual die variants. | 재고 | - | |
 CONGA-QA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
HPC/SILH-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | 재고 | - | |
HPC/CALP-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. | 재고 | - | |
 CONGA-SA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 32 | - | |
CONGA-TCA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
TC670/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-TCA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
JC370/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (threaded). Total height 12mm. | 재고 | - | |
 CONGA-PA5/I-HSP-BHeat Sinks | congatec | Heat Sinks conga-PA5/i-HSP-B | 12 | - | |
 CONGA-SA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with open-die Intel Pentium and Celeron J and N processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-HPC/MRLP-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/mRLP. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-B7E3/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all single die variants. | 재고 | - | |
HPC/SILL-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | 재고 | - | |
 CONGA-QMX8-PLUS/HSP-THeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-MA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with open-die Intel Pentium/Celeron N and J processors. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-MA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 57 | - |
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