전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
015191Heat Sinks | congatec | Standard Heat Spreader | 재고 | - | |
050053Heat Sinks | congatec | Standard Heat Spreader for SMARC 2.0 Module with lidded Atom Processor | 재고 | - | |
050354Heat Sinks | congatec | Standard Heat Spreader for High Performance COM Express Module | 재고 | - | |
049455Heat Sinks | congatec | Standard Heat Spreader for COM Express Mini Type10 Module | 재고 | - | |
048954Heat Sinks | congatec | Heat Spreader Solution | 재고 | - | |
46452Heat Sinks | congatec | Heat Sink Passive | 재고 | - | |
47533Heat Sinks | congatec | Heat Sink Passive | 재고 | - | |
CONGA-QA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-SA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 6 | - | |
CONGA-MA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA3/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven modules conga-QA3, QA3E and QA4. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-SMX8-MINI/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TS170/CSA-HP-THeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TS570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TS570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TC370/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | 재고 | - | |
CONGA-MA5/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-B7XD/HSP-CU-BHeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-B | 재고 | - | |
CONGA-PA7/HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on open silicon Intel Pentium and Celeron J and N processors . All standoffs are M2.5 thread. | 재고 | - | |
CONGA-TCA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
B7XI/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Basic modules conga-B7XI with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. | 재고 | - | |
CONGA-QMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA3/HSP-BHeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | 32 | - | |
CONGA-QA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga QA7 with open die Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | 재고 | - |