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(163 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 46454Heat Sinks | congatec | Heat Sink Passive | 재고 | - | |
 CONGA-MA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 15 | - | |
 CONGA-TCA5/I-CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
SMX8-PLUS/HSP-BHeat Sinks | congatec | Heat Sinks Heat spreader solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-QMX6/HSP2-THeat Sinks | congatec | Heat Sinks STANDARD HEAT SPREADER QMX6 2MM | 재고 | - | |
CONGA-QMX6/HSP1-THeat Sinks | congatec | Heat Sinks Standard heatspreader with 1mm gap pad for Qseven module conga-QMX6 with processors with LIDDED FCBGA package (PN: 016112, 016113). Threaded standoffs, M2.5. | 2 | - | |
HPC/CALS-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALS with integrated heat pipes, 13mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
ICX/CSPHeat Sinks | congatec | Heat Sinks Passive cooling for conga-IC87/IC97/IC170/IC175, 85L*85W*27H (mm) / 165 g, Aluminum, to be used with conga-ICx/Retention Frame PN 052254. | 재고 | - | |
 CONGA-B7E3/SP4-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heat spreader for high performance COM Express Type 7 module conga-B7E3 with integrated heat pipes. All stand-offs are M2.5 threaded. Suitable for all dual die variants. | 재고 | - | |
CONGA-TC700/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC700 with integrated heat pipes, 11mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-HPC/CTLU-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader solution for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with M2.5mm thread. | 재고 | - | |
 CONGA-SA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
 CONGA-TS170/CSA-HP-BHeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | 재고 | - | |
TC670/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-MA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 23 | - | |
 CONGA-JC370/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (threaded). Total height 12mm. | 재고 | - | |
CONGA-TS170/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA3/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are 2.7mm bore hole. | 재고 | - | |
CONGA-QMX6/HSP3-THeat Sinks | congatec | Heat Sinks Standard heatspreader with heat stack solution for Qseven module conga-QMX6 for processors with open silicon FCBGA package (PN: 016102, 016103, 016104). Threaded standoffs, M2.5. | 154 | - | |
HPC/CALP-HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC module conga-HPC/cALP with integrated heat pipes, 13mm height. All standoffs are M2.5mm threaded. | 재고 | - | |
 CONGA-SA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 32 | - | |
CONGA-TCA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
HPC/SILL-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | 재고 | - | |
 CONGA-TCA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-QMX8-PLUS/HSP-THeat Sinks | congatec | Heat Sinks Heat spreader solution for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are M2.5mm thread. | 재고 | - |
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