전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
015537Heat Sinks | congatec | Standard Heat spreader for Qseven Module Conga-QA5 with Open Silicon Pentium and Celeron processor | 재고 | - | |
42051Heat Sinks | congatec | Standard Heat Spreader for COM Express module | 재고 | - | |
47352Heat Sinks | congatec | Heat Sink Passive | 재고 | - | |
47750Heat Sinks | congatec | Heat Sink Passive | 재고 | - | |
15190Heat Sinks | congatec | Heat Sink Spreader | 재고 | - | |
016160Heat Sinks | congatec | Standard Heat Spreader | 재고 | - | |
15192Heat Sinks | congatec | Standard Heat Spreader | 재고 | - | |
CONGA-PA7/I-HSP-THeat Sinks | congatec | Heat Sinks Heatspreader solution for conga-PA7 based on lidded silicon Intel Atom x6000E processors. All standoffs are M2.5 thread. | 2 | - | |
CONGA-SMX8-MINI/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for SMARC 2.0 module conga-SMX8-Mini with NXP i.MX 8M Mini ARM processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-XLX/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader for conga-XLX, standoff with 2.7mm bore hole | 재고 | - | |
CONGA-SA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC 2.1 module conga-SA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TS170/CSA-HP-BHeat Sinks | congatec | Heat Sinks Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
TC670/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC670 with integrated heat pipes, 11mm height. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-MA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 23 | - | |
CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | 재고 | - | |
CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TS170/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA3/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express modules conga-TCA3 and TCA4. All standoffs are 2.7mm bore hole. | 재고 | - | |
CONGA-QA5/CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for Qseven module conga-QA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-PA5/I-HSP-BHeat Sinks | congatec | Heat Sinks conga-PA5/i-HSP-B | 12 | - | |
HPC/SILL-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | 재고 | - |