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(163 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 CONGA-TCA7/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-STDA4/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for SMARC Module conga-STDA4 based on TI ARM | 재고 | - | |
 CONGA-MA7/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole. | 5 | - | |
 CONGA-XLX/HSP-BHeat Sinks | congatec | Heat Sinks Heatspreader for conga-XLX, standoff with 2.7mm bore hole | 재고 | - | |
 CONGA-TCA3/CSP-THeat Sinks | congatec | Heat Sinks Standard passive cooling solution for COM Express modules conga-TCA3 and TCA4 with 20mm overall heat sink height. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-TC570/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-MA5/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-TCA7/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for COM Express Compact module conga-TCA7 with open silicon Intel Pentium/Celeron J and N processors. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-HPC/CTLU-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 1 | - | |
 CONGA-QA7/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole. | 재고 | - | |
JC370/HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-JC370 (bore hole). Total height 12mm. | 재고 | - | |
 CONGA-QA5/I-HSP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 5 | - | |
CONGA-TCR8/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are with 2.7mm bore hole. | 재고 | - | |
TCV2/HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
 CONGA-QMX8/HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread. | 재고 | - | |
 CONGA-TCA5/CSP-THeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCR8/HSP-HP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM Express module conga-TCR8 with integrated heat pipes. All standoffs are M2.5mm threaded. | 재고 | - | |
 CONGA-HPC/CTLH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-QA5/I-HSP-THeat Sinks | congatec | Heat Sinks Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are M2.5mm thread. | 재고 | - | |
CONGA-TCA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Compact module conga-TCA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 재고 | - | |
CONGA-MA5/I-CSP-BHeat Sinks | congatec | Heat Sinks Passive cooling solution for COM Express Mini Type10 module conga-MA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. | 1 | - | |
HPC/SILH-HSP-HP-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs 2.7mm. | 재고 | - | |
 CONGA-QA3/HSP-THeat Sinks | congatec | Heat Sinks HEATSPREADER FOR conga-QA3 2.7mm | 재고 | - | |
CONGA-UMX6/HSP3-BHeat Sinks | congatec | Heat Sinks Standard heatspreader for conga-UMX6 module with Non-Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants. | 재고 | - | |
CONGA-B7XD/HSP-CU-THeat Sinks | congatec | Heat Sinks conga-B7XD/HSP-Cu-T | 재고 | - |
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