방열판

(171 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
CUI Devices_HSS15-B20-P40

HSS15-B20-P40

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 23.
4826
-
CUI Devices_HSB13-303014

HSB13-303014

Heat Sinks
CUI Devices HEAT SINK, BGA, 30.7 X 30.7 X 14
390
-
CUI Devices_HSS11-B20-P38

HSS11-B20-P38

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 50.
2150
-
CUI Devices_HSS08-B18-CP

HSS08-B18-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218, 44.
984
-
CUI Devices_HSB16-404018

HSB16-404018

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 18 MM
1174
-
CUI Devices_HSB12-272706

HSB12-272706

Heat Sinks
CUI Devices HEAT SINK, BGA, 27 X 27 X 6 MM
1293
-
CUI Devices_HSS06-C20-P32

HSS06-C20-P32

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 27.
358
-
CUI Devices_HSB06-181810

HSB06-181810

Heat Sinks
CUI Devices HEAT SINK, BGA, 18 X 18 X 10 MM
1980
-
CUI Devices_HSB22-606010

HSB22-606010

Heat Sinks
CUI Devices HEAT SINK, BGA, 60 X 60 X 10 MM
재고
-
CUI Devices_HSB04-171706

HSB04-171706

Heat Sinks
CUI Devices HEAT SINK, BGA, 17 X 17 X 6 MM
2207
-
CUI Devices_HSB20-353525

HSB20-353525

Heat Sinks
CUI Devices HEAT SINK, BGA, 35 X 35 X 25 MM
560
-
CUI Devices_HSB11-252518

HSB11-252518

Heat Sinks
CUI Devices HEAT SINK, BGA, 25 X 25 X 18 MM
203
-
CUI Devices_HSB02-101007

HSB02-101007

Heat Sinks
CUI Devices HEAT SINK, BGA, 10 X 10 X 7 MM
3079
-
CUI Devices_HSB19-272718

HSB19-272718

Heat Sinks
CUI Devices HEAT SINK, BGA, 27 X 27 X 18 MM
518
-
CUI Devices_HSS10-B20-P40

HSS10-B20-P40

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 29.
1675
-
CUI Devices_HSB07-202009

HSB07-202009

Heat Sinks
CUI Devices HEAT SINK, BGA, 20 X 20 X 9 MM
3
-
CUI Devices_HSS12-B20-P95

HSS12-B20-P95

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 19
재고
-
CUI Devices_HSE01-193175

HSE01-193175

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, 19 X 31.5
1539
-
CUI Devices_HSB26-343408

HSB26-343408

Heat Sinks
CUI Devices HEAT SINK, BGA, 33.5 X 33.5 X 8
805
-
CUI Devices_HSE06-503045

HSE06-503045

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1022
-
CUI Devices_HSE10-B20-NP

HSE10-B20-NP

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
2728
-
CUI Devices_HSS24-B20-NP

HSS24-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2894
-
CUI Devices_HSE04-251265-1

HSE04-251265-1

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
2137
-
CUI Devices_HSB24-252510

HSB24-252510

Heat Sinks
CUI Devices HEAT SINK, BGA,25 X 25 X 10 MM
1252
-
CUI Devices_HSS23-B20-NP

HSS23-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2521
-