방열판

(171 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
CUI Devices_HSB15-404010

HSB15-404010

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 10 MM
931
-
CUI Devices_HSB05-171711

HSB05-171711

Heat Sinks
CUI Devices HEAT SINK, BGA, 17 X 17 X 11.5 M
1865
-
CUI Devices_HSB08-212106

HSB08-212106

Heat Sinks
CUI Devices HEAT SINK, BGA, 21 X 21 X 6 MM
1566
-
CUI Devices_HSS11-B20-P38

HSS11-B20-P38

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 50.
2150
-
CUI Devices_HSS08-B18-CP

HSS08-B18-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218, 44.
984
-
CUI Devices_HSB01-080808

HSB01-080808

Heat Sinks
CUI Devices HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
1866
-
CUI Devices_HSS07-C20-P274

HSS07-C20-P274

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 21.
2297
-
CUI Devices_HSB18-232310

HSB18-232310

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 10 MM
4703
-
CUI Devices_HSS13-B20-NP

HSS13-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 31
1198
-
CUI Devices_HSB03-121218

HSB03-121218

Heat Sinks
CUI Devices HEAT SINK, BGA, 12 X 12 X 18 MM
133
-
CUI Devices_HSB10-232306

HSB10-232306

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 6 MM
재고
-
CUI Devices_HSB14-353518

HSB14-353518

Heat Sinks
CUI Devices HEAT SINK, BGA, 35 X 35 X 18 MM
816
-
CUI Devices_HSS14-B20-NP

HSS14-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 19.
4992
-
CUI Devices_HSS03-B20-P318

HSS03-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1820
-
CUI Devices_HSB17-404025

HSB17-404025

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 25 MM
281
-
CUI Devices_HSB21-454515

HSB21-454515

Heat Sinks
CUI Devices HEAT SINK, BGA, 45 X 45 X 15 MM
1032
-
CUI Devices_HSS01-B20-CP

HSS01-B20-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 49.
1083
-
CUI Devices_HSS02-B20-P318

HSS02-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 23.
1436
-
CUI Devices_HSS04-B20-P318

HSS04-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1968
-
CUI Devices_HSS09-B20-P431

HSS09-B20-P431

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 29.
2605
-
CUI Devices_HSS05-C20-SMT-TR

HSS05-C20-SMT-TR

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 12.
1130
-
CUI Devices_HSE05-171933

HSE05-171933

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1673
-
CUI Devices_HSS21-B20-P53

HSS21-B20-P53

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
재고
-
CUI Devices_HSS27-B20-P43

HSS27-B20-P43

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2396
-
CUI Devices_HSS28-B20-P39

HSS28-B20-P39

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
재고
-