방열판

(171 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
CUI Devices_VHS-45

VHS-45

Heat Sinks
CUI Devices Heat Sink Passive Extruded Screw Mount Black Anodized
재고
-
CUI Devices_VHS-95

VHS-95

Heat Sinks
CUI Devices Heat Sink Passive Extruded Screw Mount Aluminum 6063-P5 Black Anodized
재고
-
CUI Devices_HSE-B2111-038

HSE-B2111-038

Heat Sinks
CUI Devices Extruded Heat Sink, TO-220
15782
-
CUI Devices_HSE-B254-04H

HSE-B254-04H

Heat Sinks
CUI Devices Extruded Heat Sink, TO-220 / TO-218
328
-
CUI Devices_HSB03-141406

HSB03-141406

Heat Sinks
CUI Devices HEAT SINK, BGA, 14 X 14 X 6 MM
931
-
CUI Devices_HSB15-404010

HSB15-404010

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 10 MM
931
-
CUI Devices_HSB05-171711

HSB05-171711

Heat Sinks
CUI Devices HEAT SINK, BGA, 17 X 17 X 11.5 M
1865
-
CUI Devices_HSB09-212115

HSB09-212115

Heat Sinks
CUI Devices HEAT SINK, BGA, 21 X 21 X 15 MM
재고
-
CUI Devices_HSB08-212106

HSB08-212106

Heat Sinks
CUI Devices HEAT SINK, BGA, 21 X 21 X 6 MM
1566
-
CUI Devices_HSB01-080808

HSB01-080808

Heat Sinks
CUI Devices HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
1866
-
CUI Devices_HSS07-C20-P274

HSS07-C20-P274

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 21.
2297
-
CUI Devices_HSB18-232310

HSB18-232310

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 10 MM
4703
-
CUI Devices_HSS13-B20-NP

HSS13-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 31
1198
-
CUI Devices_HSB03-121218

HSB03-121218

Heat Sinks
CUI Devices HEAT SINK, BGA, 12 X 12 X 18 MM
133
-
CUI Devices_HSB10-232306

HSB10-232306

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 6 MM
재고
-
CUI Devices_HSB14-353518

HSB14-353518

Heat Sinks
CUI Devices HEAT SINK, BGA, 35 X 35 X 18 MM
816
-
CUI Devices_HSS14-B20-NP

HSS14-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 19.
4992
-
CUI Devices_HSS03-B20-P318

HSS03-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1820
-
CUI Devices_HSB17-404025

HSB17-404025

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 25 MM
281
-
CUI Devices_HSB21-454515

HSB21-454515

Heat Sinks
CUI Devices HEAT SINK, BGA, 45 X 45 X 15 MM
1032
-
CUI Devices_HSS01-B20-CP

HSS01-B20-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 49.
1083
-
CUI Devices_HSS02-B20-P318

HSS02-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 23.
1436
-
CUI Devices_HSS04-B20-P318

HSS04-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1968
-
CUI Devices_HSS09-B20-P431

HSS09-B20-P431

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 29.
2605
-
CUI Devices_HSS05-C20-SMT-TR

HSS05-C20-SMT-TR

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 12.
1130
-