방열판

(171 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
CUI Devices_HSB23-232325

HSB23-232325

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 25 MM
612
-
CUI Devices_HSS25-B20-P51

HSS25-B20-P51

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
재고
-
CUI Devices_HSS19-B20-NP

HSS19-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2445
-
CUI Devices_HSS20-B20-NP

HSS20-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
1885
-
CUI Devices_HSE02-173213

HSE02-173213

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, 17 X 31.9
2795
-
CUI Devices_HSB30-373710

HSB30-373710

Heat Sinks
CUI Devices HEAT SINK, BGA, 37.4 X 37 X 10 M
417
-
CUI Devices_HSE01-193175P

HSE01-193175P

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, 19 X 31.5
2055
-
CUI Devices_HSB27-434316

HSB27-434316

Heat Sinks
CUI Devices HEAT SINK, BGA, 43.1 X 43.1 X 16
979
-
CUI Devices_HSB25-282810

HSB25-282810

Heat Sinks
CUI Devices HEAT SINK, BGA, 28.5 X 28.5 X 10
1077
-
CUI Devices_HSE01-193175

HSE01-193175

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, 19 X 31.5
1539
-
CUI Devices_HSB26-343408

HSB26-343408

Heat Sinks
CUI Devices HEAT SINK, BGA, 33.5 X 33.5 X 8
805
-
CUI Devices_HSE06-503045

HSE06-503045

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1022
-
CUI Devices_HSE10-B20-NP

HSE10-B20-NP

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
2728
-
CUI Devices_HSS24-B20-NP

HSS24-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2894
-
CUI Devices_HSE04-251265-1

HSE04-251265-1

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
2137
-
CUI Devices_HSE02-173213P

HSE02-173213P

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, 17 X 31.9
2746
-
CUI Devices_HSB24-252510

HSB24-252510

Heat Sinks
CUI Devices HEAT SINK, BGA,25 X 25 X 10 MM
1252
-
CUI Devices_HSS23-B20-NP

HSS23-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2521
-
CUI Devices_HSE11-B20-NP

HSE11-B20-NP

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
재고
-
CUI Devices_HSE09-755028

HSE09-755028

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
969
-
CUI Devices_HSE04-251265-2

HSE04-251265-2

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1751
-
CUI Devices_HSE07-753045

HSE07-753045

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
970
-
CUI Devices_HSS26-B20-P38

HSS26-B20-P38

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2998
-
CUI Devices_HSE12-B20-NP

HSE12-B20-NP

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1969
-
CUI Devices_HSE08-505028

HSE08-505028

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
100
-