메모리는 집적 회로에서 데이터 저장 장치로 사용되는 반도체 장치입니다. 이러한 장치는 비휘발성 또는 휘발성의 CBRAM, DRAM, EEPROM, EERAM, EPROM, 플래시, FRAM, NVSRAM, PCM(PRAM), PSRAM, RAM 및 SRAM의 여러 형식으로 제공됩니다. 이 장치의 메모리 크기는 64b ~ 6Tb이며 인터페이스는 I2C, MMC, 병렬, eMMC, 직렬, 단일 와이어, SPI, UFS, Xccela 버스 및 1-Wire입니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
K4S281632F-UC60Memory ICs Products | SAMSUNG | 34009 | - | ||
K9F1G08U0E-SCB0Memory ICs Products | SAMSUNG | SLC NAND Flash 3.3V 1G-bit 128M x 8 48-Pin TSOP-I | 3821 | - | |
K4S561632J-UC75Memory ICs Products | SAMSUNG | Synchronous DRAM, 16MX16, 5.4ns, CMOS, PDSO54, | 3015 | - | |
K4S281632C-TL75Memory ICs Products | SAMSUNG | Synchronous DRAM, 8MX16, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 | 재고 | - | |
K4T51163QQ-BCE7Memory ICs Products | SAMSUNG | DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V | 20020 | - | |
K4D261638I-LC50Memory ICs Products | SAMSUNG | DDR DRAM, 8MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | 재고 | - | |
K6F8016U6D-FF70Memory ICs Products | SAMSUNG | 512K x16 bit Super Low Power and Low Voltage Full CMOS Static RAM | 4010 | - | |
K4R271669FMemory ICs Products | SAMSUNG | 128Mbit RDRAM(F-die) | 7421 | - | |
K4H511638C-ZCB3Memory ICs Products | SAMSUNG | DDR DRAM, 32MX16, 0.7ns, CMOS, PBGA60, | 재고 | - | |
K4S643232F-TI70Memory ICs Products | SAMSUNG | 재고 | - | ||
K4B1G1646G-BCNBMemory ICs Products | SAMSUNG | DDR DRAM, 64MX16, 0.18ns, CMOS, PBGA96 | 20003 | - | |
K7N801845B-QC13Memory ICs Products | SAMSUNG | ZBT SRAM, 512KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, TQFP-100 | 7020 | - | |
K6R4008C1D-TC10Memory ICs Products | SAMSUNG | 256Kx16 Bit High Speed Static RAM(5.0V Operating). Operated at Commercial and Industrial Temperature Ranges. | 재고 | - | |
K4S643232F-TL60Memory ICs Products | SAMSUNG | 재고 | - | ||
K6T0808C1D-TF70Memory ICs Products | SAMSUNG | 재고 | - | ||
KFG1G16Q2D-HEB8Memory ICs Products | SAMSUNG | 1Gb OneNAND Flash | 재고 | - | |
K9F5608U0D-JIB0Memory ICs Products | SAMSUNG | Flash, 32MX8, 30ns, PBGA63 | 7203 | - | |
K521H12ACJ-B050Memory ICs Products | SAMSUNG | MCP 1G NAND/512M LPDDR SDRAM | 재고 | - | |
K6F2016U4E-EF55T00Memory ICs Products | SAMSUNG | SRAM 128Kx16-5 | 재고 | - | |
K6X4008T1F-GF70TMemory ICs Products | SAMSUNG | SRAM 512Kx8 | 재고 | - | |
K7P323674C-HC30Memory ICs Products | SAMSUNG | SRAM Chip | 재고 | - | |
K7R163682B-FI20Memory ICs Products | SAMSUNG | QDR2 SRAM 512kx36 FBGA | 재고 | - | |
KM6264BL-10Memory ICs Products | SAMSUNG | Standard SRAM, 8KX8, 100ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | 3857 | - | |
K7R323682C-EC25Memory ICs Products | SAMSUNG | QDR2 SRAM 1Mx36 FGBA Pb-Free | 재고 | - | |
K7I641882M-EC25Memory ICs Products | SAMSUNG | Standard SRAM, 4MX18, 0.45ns, CMOS, PBGA165 | 재고 | - |