메모리는 집적 회로에서 데이터 저장 장치로 사용되는 반도체 장치입니다. 이러한 장치는 비휘발성 또는 휘발성의 CBRAM, DRAM, EEPROM, EERAM, EPROM, 플래시, FRAM, NVSRAM, PCM(PRAM), PSRAM, RAM 및 SRAM의 여러 형식으로 제공됩니다. 이 장치의 메모리 크기는 64b ~ 6Tb이며 인터페이스는 I2C, MMC, 병렬, eMMC, 직렬, 단일 와이어, SPI, UFS, Xccela 버스 및 1-Wire입니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
K4E6E304EB-EGCFMemory ICs Products | SAMSUNG | DRAM Chip Mobile LPDDR3 SDRAM 16Gbit 512Mx32 1.2V/1.8V 178-Pin FBGA | 재고 | - | |
K4B4G1646D-BHMAMemory ICs Products | SAMSUNG | DDR DRAM, 256MX16, CMOS, PBGA96, FBGA-96 | 12976 | - | |
K4E8E324EB-EGCGMemory ICs Products | SAMSUNG | K4E8E324EB-EGCG^SAMSUNG | 재고 | - | |
KLM8G1GEUF-B04QT57Memory ICs Products | SAMSUNG | High-Performance eMMC Flash | 재고 | - | |
KLM8G1WEPD-B03100Memory ICs Products | SAMSUNG | Managed NAND Flash Memory | 재고 | - | |
K4A4G165WE-BCRCT00Memory ICs Products | SAMSUNG | DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA | 재고 | - | |
KLUCG2K1EA-B0C10Memory ICs Products | SAMSUNG | MLC NAND Flash Serial e-MMC 3.3V 512G-bit 256G x 2-bit 153-Pin FBGA | 재고 | - | |
KLM4G1FETE-B041001Memory ICs Products | SAMSUNG | Mainstream, eMMC v5.0 Flash | 재고 | - | |
KLMBG2JETD-B041003Memory ICs Products | SAMSUNG | eMMC architecture for embedded memory | 재고 | - | |
K4FBE3D4HB-MGCL000Memory ICs Products | SAMSUNG | DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.2V/1.8V 200-Pin FBGA | 재고 | - | |
K4T1G084QF-BCF7Memory ICs Products | SAMSUNG | DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60 | 1718 | - | |
K4B4G0846E-BYMA0CVMemory ICs Products | SAMSUNG | DRAM Chip DDR3L SDRAM 4Gbit 512Mx8 1.35V/1.5V 78-Pin FBGA | 재고 | - | |
K4B2G0846D-HCH9Memory ICs Products | SAMSUNG | DDR DRAM, 256MX8, 0.255ns, CMOS, PBGA78 | 35111 | - | |
K4B2G1646Q-BMK0000Memory ICs Products | SAMSUNG | DRAM Chip DDR3L SDRAM 2Gbit 128Mx16 1.35V 96-Pin FBGA | 재고 | - | |
KLM8G1GEAC-B001Memory ICs Products | SAMSUNG | MANAGED NAND FLASH MEMORY | 1010 | - | |
K4B1G1646G-BCNBT000Memory ICs Products | SAMSUNG | 재고 | - | ||
K7D803671B-HC25000Memory ICs Products | SAMSUNG | 256KX36 And 512KX18 SRAM | 재고 | - | |
KLMBG4GEUF-B04PMemory ICs Products | SAMSUNG | Embedded mmc Solution Storage | 재고 | - | |
K4B1G1646I-BMMAMemory ICs Products | SAMSUNG | DRAM Chip DDR3L SDRAM 1Gbit 64Mx16 1.35V/1.5V 96-Pin FBGA | 1120 | - | |
K4B2G1646F-BCK0Memory ICs Products | SAMSUNG | DRAM Chip DDR3 SDRAM 2Gbit 128Mx16 1.5V 96-Pin FBGA | 36405 | - | |
K4B4G1646D-BCK0000Memory ICs Products | SAMSUNG | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 90-Pin FBGA | 2629 | - | |
K4B4G1646D-BYK0Memory ICs Products | SAMSUNG | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.35V/1.5V 96-Pin FBGA | 4013 | - | |
K4B4G1646D-BCMAMemory ICs Products | SAMSUNG | DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.5V 90-Pin FBGA | 3632 | - | |
KLM8G1GETF-B041003Memory ICs Products | SAMSUNG | MLC NAND Flash Serial e-MMC 3V/3.3V 64G-bit 64G/16G/8G x 1/4-bit/8-bit 153-Pin FBGA | 재고 | - | |
K4B2G1646F-BIK0000Memory ICs Products | SAMSUNG | 2Gb DDR3L DRAM Chip | 재고 | - |