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(1720 결과)Uncategorized.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 PM-6150-0-WLPSP199-HR-02-0Unclassified | Qualcomm | PMIC for Talos | 99 | - | |
PMK-8550-0-FOWPSP42-SR-02-0Unclassified | Qualcomm | Clock chip supporting SM8550/SM8550+ chipsets | 재고 | - | |
PM-8550VE-0-WLPSP104-SR-01-0Unclassified | Qualcomm | PM-8550VE-0-WLPSP104-SR-01-0 | 재고 | - | |
PM-8550-0-FOWPSP110B-SR-01-0Unclassified | Qualcomm | PM-8550-0-FOWPSP110B-SR-01-0 | 재고 | - | |
PMI-8998-0-182WLNSP-SR-03-3Unclassified | Qualcomm | Interface PMIC to support MSM8958/MSM8998 | 재고 | - | |
AR9331-AL1A-RUnclassified | Qualcomm | AR9331-AL1A. | 재고 | - | |
QCC-3003-0-52MQFN-MT-00-0Unclassified | Qualcomm | Headset ROM device, stereo output, 1 mic cVc, 6x6 a2QFN52 0.4mm pitch | 재고 | - | |
WCN-3620-0-61WLNSP-SR-05-0Unclassified | Qualcomm | Wireless Connectivity triple combo device | 재고 | - | |
AR8131ML-AL1EUnclassified | Qualcomm | AR8131ML: 3RD GENERATION GIGABIT ETHERNET LOM W/ EEPROM (PCIE/48-QFN/L1C) FOR OEM's | 재고 | - | |
PM-8150A-1-FOWPSP177-TR-02-0Unclassified | Qualcomm | Secondary core PMIC for Hana chipset with AMOLED; FXWLP | 재고 | - | |
65-Y7763-2Unclassified | Qualcomm | DTP KIT, PL16-MODIFIED FOR AUTOMOTIVE, QCA7000, EMBEDDED EVALUATION | 재고 | - | |
WCN-7851-1-NSP334-TR-01-0Unclassified | Qualcomm | WCN-7851-1-NSP334-TR-01-0 | 재고 | - | |
PM-4250-0-FOWNSP144-MT-00-0Unclassified | Qualcomm | PM4250 (000-0), FOWNSP144, CORE PMIC TO SUPPORT KAMORTA CHIPSET, WAIMEA (1.1.0), SMIC/TSMC/SEC | 재고 | - | |
SMB-1393-0-WLPSP72B-TR-01-0-03Unclassified | Qualcomm | SMB-1393-0-WLPSP72B-TR-01-0-03 | 재고 | - | |
WCN-6856-5-NSP288-TR-02-1Unclassified | Qualcomm | WCN-6856-5-NSP288-TR-02-1 | 재고 | - | |
WCN-6856-1-NSP288-TR-02-1Unclassified | Qualcomm | WCN-6856-1-NSP288-TR-02-1 | 재고 | - | |
QCS-6490-3-PSP1287-TR-00-0-AAUnclassified | Qualcomm | CPU 1x2.7G,3x2.4G,4x1.95G;16GB DDR;GPU 812M;ADSP L2CC+TCM 2MB;LPI 1MB;EliteG;Sec-Cam-DSP;APPS;IND IOT | 재고 | - | |
QCS-5430-3-PSP1287-TR-00-0-AAUnclassified | Qualcomm | CPU 1x2.7G,3x2.4G,4x1.95G;16GB DDR;GPU 812M;ADSP L2CC+TCM 2MB;LPI 1MB;EliteG;Sec-Cam-DSP;APPS;IND IOT-Scalable | 재고 | - | |
QAM-8155P-0-BGM970-MT-00-0-ACUnclassified | Qualcomm | QAM-8155P-0-BGM970-MT-00-0-AC | 재고 | - | |
PM-8010-0-WLPSP20-SR-U4-0Unclassified | Qualcomm | Camera PMIC. | 재고 | - | |
QCA-7006AQ-0-68BMQFN-TR-00-0Unclassified | Qualcomm | QCA-7006AQ-0-68BMQFN-TR-00-0 | 재고 | - | |
QCC-7226-1-PSP244-TR-03-0Unclassified | Qualcomm | 2.0 128Mb STK 2.4GHz BT, Apps, Sensor/Context Proc Hub, Dual DSP, NNU, Low Lat DSP, Root of trust & security services, PMU, Codec (4xADC) | 재고 | - | |
65-79685-3Unclassified | Qualcomm | 65-79685-3 | 5 | - | |
QCC-5229-0-PSP205-TR-00-0Unclassified | Qualcomm | QCC5229 PRODUCTION PART, SECURE, LOCKED; DUETTO2 TRIPLE STK (128Mb) FC-HYB205, 6.85X4.85X0.876MM | 재고 | - | |
PM-8010-0-WLPSP20-TR-U4-0Unclassified | Qualcomm | Camera PMIC. | 재고 | - |
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