Uncategorized.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
EXPRESS-RLP-I3-1315UEUnclassified | ADLINK Technology | ADLINK Technology Basic size COM Express Type 6 module based on Intel Raptor Lake-P i3-1315UE 1.2GHz/6C 15W | 재고 | - | |
RK-620BUnclassified | ADLINK Technology | ADLINK Technology 19"4U Rackmount ChassisFor SBC 14-Slot,Black Package Printing with ADLINK LogoPackage Size:612x540x325mm | 재고 | - | |
MVP-5207 M128GUnclassified | ADLINK Technology | ADLINK Technology i7-12700E, R680E, 2xDP,2x HDMI , 3x 2.5GbE, 4xCOM, 4xUSB3Gen2, 2xUSB3Gen1, USB2 dongle, 8DI/8DO, 2xUSIM, TPM2.0, M.2(A,B,M), 2x2.5" SATA, 4x DDR5 32GB | 재고 | - | |
CFAST 256GBUnclassified | ADLINK Technology | ADLINK Technology CFast Card, 256GB, SATA Mode, innodisk 112 Layars 3D TLC, 550R/490W, 3.3V, TBW:682TB, MTBF>3MH, OP Temp:0-70 | 재고 | - | |
ABX-52ADL-MB-R680Unclassified | ADLINK Technology | ADLINK Technology ABX-52ADL-MB-R680, Alder Lake-S, PCH R680E,2xDP,2x HDMI , 3x 2.5GbE, 1x GbE, 4xCOM, 4xUSB3Gen2, 2xUSB3Gen1, USB2 dongle, 8DI/8DO, line-out/mic-in, 2xUSIM, TPM2.0, M.2(A,B,M), 2x2.5" SATA, 4x DDR5 SODIMM | 재고 | - | |
I-COM-HPC-SIDH-2796-C827 DEV KITUnclassified | ADLINK Technology | ADLINK Technology COM-HPC Intel Ice Lake-D HCC development kit with D-2796 CPU module, with carrier, C827 OCP, heatsink and accessories | 재고 | - | |
WIRE 2X3P 3.0 TO 1X2P 2X3P 1X4PUnclassified | ADLINK Technology | ADLINK Technology Wire: UL1007, 18AWG/20AWG, L=300+/-10mm;P1: JVT3025HNO, 2x3P, Ptich:3.0mm; P2: JVT_JVT1149HN2-06L+02C-A, 1x2P/2x3P, Ptich:4.2mm;P3: 2101H-04, 1x4P, Ptich:5.08mm | 재고 | - | |
DDR5 4800 8GB NON-ECC-SO-DIMMUnclassified | ADLINK Technology | ADLINK Technology DDR5-4800, 8GB, 1Gx64, SO-DIMM 262P, 1.1V, Rank:1, CL40, non-ECC, OP Temp:-40-95, Fix Die:No(B-die), Samsung Chip(1Gx16), anti-sulfur | 재고 | - | |
NEON-203B-ONO STARTER KITUnclassified | ADLINK Technology | ADLINK Technology NEON-203B-ONO Starter Kit, Orin Nano, 2M color sensor, 30fps, rolling shutter, w/all accessory | 재고 | - | |
M9044A USB-C LABELUnclassified | ADLINK Technology | ADLINK Technology Dimension: 146.92x13mm;Material: LEXAN 8A35 or PC-815 (T=0.25mm);Adhesive: 3M467MP or Equivalent;Background Color: Gray(6009-0425) | 재고 | - | |
HTS-QELUnclassified | ADLINK Technology | ADLINK Technology Heatspreader for Q7-EL | 재고 | - | |
PXIE-3U1S 9 3U3S 1Unclassified | ADLINK Technology | ADLINK Technology PXIe-3U1S*9+3U3S*1for PXES-2590 | 재고 | - | |
ABX-51G2-MB-H310Unclassified | ADLINK Technology | ADLINK Technology ABX-51G2-MB-H310MB of MVP-5100, Coffee Lake Refresh-S, PCH H310, 2xDP, DVI, VGA, 3xGbE, 4xCOM, 3xUSB2, 3xUSB3, USB dongle, 16xDIO, audio, mPCIe, M.2, 2xUSIM, CFast, 2x 2.5" SATA | 재고 | - | |
Q7-EL-6413E-8G-64G-CTUnclassified | ADLINK Technology | ADLINK Technology Qseven Module with Intel Atom x6413E quad core, 8GB LPDDR4, 64GB eMMC, 0C to 70C | 재고 | - | |
RK-410SX-CWUnclassified | ADLINK Technology | ADLINK Technology GH-402 ATX 1C19" Rackmount 4U ChassisChroma WhiteSuppport ATX M/BCarton Size: 618x340x590mm | 재고 | - | |
CPU I9-14900T CM8071504820406 SRN3UUnclassified | ADLINK Technology | ADLINK Technology CPU, Core i9-14900T, 5.50GHz, 24-Core, 36MB SmartCache, Raptor Lake, CM8071504820406 SRN3U, Step:B0, MM# 99CFDN | 재고 | - | |
DDR3L 1333 204P 2GB SO-DIMM 1RX8Unclassified | ADLINK Technology | ADLINK Technology DDR3L-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL9, Non-ECC, OP Temp:0-85, Fix Die:Yes(F-die), Samsung Chip(256Mx8), SPD Write-Protection | 재고 | - | |
RK-410 5.25 COVER IN BLACK COLORUnclassified | ADLINK Technology | ADLINK Technology Material: SECC, T=1.2mm,Painting: Black,Production: Tooling | 재고 | - | |
RK-620 7SLOT 2FAN REAR WINDOWUnclassified | ADLINK Technology | ADLINK Technology RK-620 7Slot 2Fan Rear Window | 재고 | - | |
DA2D542ECUnclassified | ADLINK Technology | ADLINK Technology EtherCAT base stepper driver, support encoder feedback, Output current 1-4.2A | 재고 | - | |
FLAT 2X5P2.54 TO 2X5P2.54Unclassified | ADLINK Technology | ADLINK Technology Wire: UL2651, 28AWG, L=200+/-10mm;P1/P2:IDC, 2x5P, Pitch:2.54mm, 90 | 재고 | - | |
MVP-6227 M32GUnclassified | ADLINK Technology | ADLINK Technology i7-12700E, R680E, 1 PCIex16 + 1 PCI slots, 2x DP, 2x HDMI , 3x 2.5GbE, 4x COM, 4x USB3 Gen2, 4x USB3 Gen1, USB2 dongle, 8DI/8DO, 2x USIM, TPM2.0, M.2 (A,B,M), 2x 2.5" SATA, 1x DDR5 32GB | 재고 | - | |
CEXPRESS-EL-J6426Unclassified | ADLINK Technology | ADLINK Technology Compact COM Express Type6 with Intel Elkhart Lake Pentium J6426 | 재고 | - | |
MXC-2300-3E1 LIGHT M4GUnclassified | ADLINK Technology | ADLINK Technology MXC-2300-3E1/Light/M4GLight version of MXC-2300-3E1Bay Trail E3845 Fanless Expandable Embedded Computer with 2 PCI + 1PCIex4 slots, 9-32V DC input, 4GB DDR3L MemoryBIOS support Win 7 | 재고 | - | |
DLAP-310C-CFT3 M32GUnclassified | ADLINK Technology | ADLINK Technology i7-9700E, Q370, MXM RTX3000, 2x16GB DDR4 SODIMM, 6xDP, 6xGbE, 2xCOM, 6xUSB3, 2xUSB2, M.2 E/B/M key, TPM, Audio(AMP), DIO | 재고 | - |