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(199 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 LEC-AL-HS2Heat Sinks | ADLINK Technology | Heat Spreader for LEC-AL-N3350/N4200 | 재고 | - | |
HTS-NXAL-B-IHeat Sinks | ADLINK Technology | Heat Spreader for Nano X-AL Atom with Threaded Standoffs | 1 | - | |
HTS-SL-BHeat Sinks | ADLINK Technology | Heat Spreader for SL | 재고 | - | |
THS-CBL-BHeat Sinks | ADLINK Technology | Heat Sinks THS-cBL-BLow profile heatsink for cExpress-BL with threaded standoffs for bottom mounting | 재고 | - | |
 THSH-CTL-BTHeat Sinks | ADLINK Technology | Heat Sinks High profile heatsink for cExpress-TL with threaded standoffs for Top mounting | 재고 | - | |
LEC-AL-HS5Heat Sinks | ADLINK Technology | Heat Sinks LEC-AL-HS5Integral passive heatsink for LEC-AL-N3350/N4200 | 재고 | - | |
MXM-A4500_109.36X82X32.3MMHeat Sinks | ADLINK Technology | Heat Sinks Module ,Chip=NV GPU,EN20-E3,Size=109.36x82x32.3mm,TIM Num.=4,Fan=70x70x15.0mm/14.68CFM/4Pin/12V | 재고 | - | |
CMX-BTX-TM-20Heat Sinks | ADLINK Technology | Heat Sinks Active LP Heatsink Core Module CMx-BTx | 재고 | - | |
HTS-TL-BHeat Sinks | ADLINK Technology | Heat Sinks Heatspreader for Express-TL with threaded standoffs for bottom mounting | 재고 | - | |
HTS-SIMX8MHeat Sinks | ADLINK Technology | Heat Sinks HTS-siMX8MHeatspreader for LEC-iMX8M | 재고 | - | |
THS-TL-BTLHeat Sinks | ADLINK Technology | Heat Sinks Low profile heatsink for Express-TL with through hole standoffs for top mounting | 재고 | - | |
THS-CTL-BHeat Sinks | ADLINK Technology | Heat Sinks Low profile heatsink for cExpress-TL with threaded standoffs for bottom mounting | 재고 | - | |
HTS-CBL-BHeat Sinks | ADLINK Technology | Heat Sinks HTS-cBL-BHeatspreader for cExpress-BL with threaded standoffs for bottom mounting | 재고 | - | |
HTS-NXEL-B-IHeat Sinks | ADLINK Technology | Heat Sinks Heatspreader for nanoX-EL with threaded standoffs for bottom mounting | 재고 | - | |
THSF-AXE-BHeat Sinks | ADLINK Technology | Heat Sinks Heatsink with Fan for MXM-AXe with threaded standoffs for bottom mounting | 재고 | - | |
HTS-ID7-BTHeat Sinks | ADLINK Technology | Heat Sinks Heatspreader for Express-ID7 with through hole standoffs for top mounting | 재고 | - | |
LEC-AL-HS4Heat Sinks | ADLINK Technology | Heat Sinks LEC-AL-HS4Integral passive heatsink for LEC-AL-E3930/E3940/E3950 | 재고 | - | |
HTS-DN7-BTHeat Sinks | ADLINK Technology | Heat Sinks HTS-DN7-BTHeatspreader for Express-DN7 with through hole standoffs for top mounting | 재고 | - | |
AMITX-BW-I CPU HEAT-SINK-CHeat Sinks | ADLINK Technology | Heat Sinks AmITX-AL-I_TM-HS_3, JAC0D45C-0 (Black Screws) for Apollp Lake (N4200/N3350) CU 1100 HS 60 * 60 * 18 mm Standard Temp.: 0 C to 60 C | 재고 | - | |
HTS-CAR-BTHeat Sinks | ADLINK Technology | Heat Sinks Heatspreader for cExpress-AR with through hole standoffs fortop mounting | 재고 | - | |
EGX-MXM-T1000_82X69.82X24.7MMHeat Sinks | ADLINK Technology | Heat Sinks 1. 32-20830-0400-A02. nVIDIA GPU T10003. heat sink, 82x69.82x24.7mm4. TIM: CPU Grease 7762, 15x15mm V-Ram Pad XR-HL 33.0x15.0x1.5mm MOS pad RS300 6x38x2.0 mm5. Fan: oe55x11.2mm, PWM 4 pin, 12V | 재고 | - | |
THSH-TL-BLHeat Sinks | ADLINK Technology | Heat Sinks High profile heatsink for Express-TL with threaded standoffs for bottom mounting | 재고 | - | |
THSF-CAR-BHeat Sinks | ADLINK Technology | Heat Sinks High profile heatsink with Fan for cExpress-AR with threadedstandoffs for bottom mounting | 재고 | - | |
LEC-BTS-HSHeat Sinks | ADLINK Technology | Heat Sinks Heatspreader for SMARC Module | 재고 | - | |
THS-BD7-BTLHeat Sinks | ADLINK Technology | Heat Sinks THS-BD7-BTLLow profile heatsink for Express-BD7 with through hole standoffs for top mounting | 6 | - |
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