전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
B60-075-AEHeat Sinks | Ohmite | HEATSINK FOR TO-247 TO-264 | 25 | - | |
C60-075-AEHeat Sinks | Ohmite | Heat Sink Passive TO-247/TO-264 Aluminum Alloy 6063-T5 Black Anodized | 13 | - | |
DA-T263-301EHeat Sinks | Ohmite | HEATSINK D2PAK TO-263 ANODIZED | 재고 | - | |
DA-T263-301E-TRHeat Sinks | Ohmite | HEATSINK D2PAK TO-263 ANODIZED | 172 | - | |
DV-T263-301EHeat Sinks | Ohmite | HEATSINK D2PAK TO-263 DEGREASED | 재고 | - | |
DV-T263-301E-TRHeat Sinks | Ohmite | HEATSINK D2PAK TO-263 DEGREASED | 2400 | - | |
OMNI-UNI-18-25Heat Sinks | Wakefield Thermal | HEATSINK 18X25MM TO-247 TO-264 | 1855 | - | |
OMNI-UNI-18-50Heat Sinks | Wakefield Thermal | HEATSINK 18X50MM TO-247 TO-264 | 1 | - | |
OMNI-UNI-18-75Heat Sinks | Wakefield Thermal | HEATSINK 18X75MM TO-247 TO-264 | 194 | - | |
OMNI-UNI-32-58Heat Sinks | Wakefield Thermal | UNIVERSAL TO HEATSINK 32X58MM | 15 | - | |
OMNI-UNI-41-75Heat Sinks | Wakefield Thermal | UNIVERSAL TO HEATSINK 41X75MM | 464 | - | |
OMNI-220-18-25-1CHeat Sinks | Wakefield Thermal | HEATSINK 18X25MM 1-CLIP TO-220 | 115 | - | |
OMNI-220-18-50-2CHeat Sinks | Wakefield Thermal | HEATSINK 18X50MM 2-CLIP TO-220 | 31 | - | |
OMNI-220-18-75-3CHeat Sinks | Wakefield Thermal | HEATSINK 18X75MM 3-CLIP TO-220 | 2049 | - | |
109X6512A2016Heat Sinks | Sanyo Denki | P3, 800MHZ, FC-PGA | 재고 | - | |
109X9112PT0H016Heat Sinks | Sanyo Denki | P4,775-LAND LGA | 재고 | - | |
109X9212PT0H016Heat Sinks | Sanyo Denki | P4,775-LAND LGA | 재고 | - | |
122547Heat Sinks | Wakefield Thermal | HEATSINK EXTRUSION 15.25" | 14 | - | |
122551Heat Sinks | Wakefield Thermal | HEATSINK EXTRUSION 12.32" | 20 | - | |
HSS-B20-NPS-02Heat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Slot Hole | 328 | - | |
HSS-B20-NP-06Heat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin | 469 | - | |
HSS-B20-053H-01Heat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Aluminum, PCB, 5.3 mm Horizontal Solder Pin | 2824 | - | |
HSS-B20-0503HHeat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Aluminum, PCB, 5.03 mm Horizontal Solder Pin | 2681 | - | |
HSS-B20-NP-12Heat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin | 1026 | - | |
HSS-B20-NP-04Heat Sinks | CUI Devices | Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin | 5612 | - |