방열판

(117324 결과)

전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.

부분 # 제조업체 설명 유효성 가격 수량
Ohmite_B60-075-AE

B60-075-AE

Heat Sinks
Ohmite HEATSINK FOR TO-247 TO-264
25
-
Ohmite_C60-075-AE

C60-075-AE

Heat Sinks
Ohmite Heat Sink Passive TO-247/TO-264 Aluminum Alloy 6063-T5 Black Anodized
13
-
Ohmite_DA-T263-301E

DA-T263-301E

Heat Sinks
Ohmite HEATSINK D2PAK TO-263 ANODIZED
재고
-
Ohmite_DA-T263-301E-TR

DA-T263-301E-TR

Heat Sinks
Ohmite HEATSINK D2PAK TO-263 ANODIZED
172
-
Ohmite_DV-T263-301E

DV-T263-301E

Heat Sinks
Ohmite HEATSINK D2PAK TO-263 DEGREASED
재고
-
Ohmite_DV-T263-301E-TR

DV-T263-301E-TR

Heat Sinks
Ohmite HEATSINK D2PAK TO-263 DEGREASED
2400
-
Wakefield Thermal_OMNI-UNI-18-25

OMNI-UNI-18-25

Heat Sinks
Wakefield Thermal HEATSINK 18X25MM TO-247 TO-264
1855
-
Wakefield Thermal_OMNI-UNI-18-50

OMNI-UNI-18-50

Heat Sinks
Wakefield Thermal HEATSINK 18X50MM TO-247 TO-264
1
-
Wakefield Thermal_OMNI-UNI-18-75

OMNI-UNI-18-75

Heat Sinks
Wakefield Thermal HEATSINK 18X75MM TO-247 TO-264
194
-
Wakefield Thermal_OMNI-UNI-32-58

OMNI-UNI-32-58

Heat Sinks
Wakefield Thermal UNIVERSAL TO HEATSINK 32X58MM
15
-
Wakefield Thermal_OMNI-UNI-41-75

OMNI-UNI-41-75

Heat Sinks
Wakefield Thermal UNIVERSAL TO HEATSINK 41X75MM
464
-
Wakefield Thermal_OMNI-220-18-25-1C
Wakefield Thermal HEATSINK 18X25MM 1-CLIP TO-220
115
-
Wakefield Thermal_OMNI-220-18-50-2C
Wakefield Thermal HEATSINK 18X50MM 2-CLIP TO-220
31
-
Wakefield Thermal_OMNI-220-18-75-3C
Wakefield Thermal HEATSINK 18X75MM 3-CLIP TO-220
2049
-
Sanyo Denki_109X6512A2016

109X6512A2016

Heat Sinks
Sanyo Denki P3, 800MHZ, FC-PGA
재고
-
Sanyo Denki_109X9112PT0H016

109X9112PT0H016

Heat Sinks
Sanyo Denki P4,775-LAND LGA
재고
-
Sanyo Denki_109X9212PT0H016

109X9212PT0H016

Heat Sinks
Sanyo Denki P4,775-LAND LGA
재고
-
Wakefield Thermal_122547

122547

Heat Sinks
Wakefield Thermal HEATSINK EXTRUSION 15.25"
14
-
Wakefield Thermal_122551

122551

Heat Sinks
Wakefield Thermal HEATSINK EXTRUSION 12.32"
20
-
CUI Devices_HSS-B20-NPS-02

HSS-B20-NPS-02

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Slot Hole
328
-
CUI Devices_HSS-B20-NP-06

HSS-B20-NP-06

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin
469
-
CUI Devices_HSS-B20-053H-01

HSS-B20-053H-01

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Aluminum, PCB, 5.3 mm Horizontal Solder Pin
2824
-
CUI Devices_HSS-B20-0503H

HSS-B20-0503H

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Aluminum, PCB, 5.03 mm Horizontal Solder Pin
2681
-
CUI Devices_HSS-B20-NP-12

HSS-B20-NP-12

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin
1026
-
CUI Devices_HSS-B20-NP-04

HSS-B20-NP-04

Heat Sinks
CUI Devices Stamped Heat Sink, TO-220, Aluminum, PCB, No Pin
5612
-