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(117324 결과)전자 부품에서 생성된 열을 유체 매질(주로 공기 또는 액체 냉각수)로 전달하는 수동 열 교환기는 최적의 작동 온도를 유지하기 위해 장치에서 열을 분산시킵니다. 이는 주변 매체와 접촉하는 표면적을 최대화하도록 설계되었습니다. 열전도율이 높기 때문에 일반적으로 구리나 알루미늄으로 만들어집니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 HSS15-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 23. | 4826 | 1+: $0.82760 10+: $0.77892 100+: $0.70589 1000+: $0.68155 | |
 HSB13-303014Heat Sinks | CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 | 390 | 1+: $1.08272 10+: $1.01504 100+: $0.94738 1000+: $0.91354 | |
 HSB03-141406Heat Sinks | CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM | 931 | 1+: $0.60096 10+: $0.56560 100+: $0.51258 1000+: $0.49490 | |
 HSB15-404010Heat Sinks | CUI Devices | HEAT SINK, BGA, 40 X 40 X 10 MM | 931 | 1+: $1.26696 10+: $1.18776 100+: $1.10858 1000+: $1.06898 | |
 HSB05-171711Heat Sinks | CUI Devices | HEAT SINK, BGA, 17 X 17 X 11.5 M | 1865 | 1+: $0.86456 10+: $0.81052 100+: $0.75649 1000+: $0.72947 | |
 HSB09-212115Heat Sinks | CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM | 재고 | 1+: $0.75032 10+: $0.70620 100+: $0.63999 1000+: $0.61792 | |
 HSB08-212106Heat Sinks | CUI Devices | HEAT SINK, BGA, 21 X 21 X 6 MM | 1566 | 1+: $0.71772 10+: $0.67548 100+: $0.61216 1000+: $0.59105 | |
 HSS11-B20-P38Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 50. | 2150 | 1+: $0.81216 10+: $0.76436 100+: $0.69271 1000+: $0.66882 | |
 HSS08-B18-CPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218, 44. | 984 | 1+: $1.62104 10+: $1.56702 100+: $1.40491 1000+: $1.37789 | |
 HSB01-080808Heat Sinks | CUI Devices | HEAT SINK, BGA, 8.5 X 8.5 X 8 MM | 1866 | 1+: $0.59408 10+: $0.55914 100+: $0.50672 1000+: $0.48924 | |
 HSS07-C20-P274Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 21. | 2297 | 1+: $1.07304 10+: $1.00596 100+: $0.93890 1000+: $0.90536 | |
 HSB12-272706Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM | 1293 | 1+: $0.71772 10+: $0.67548 100+: $0.61216 1000+: $0.59105 | |
 HSS06-C20-P32Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 27. | 358 | 1+: $1.17968 10+: $1.10596 100+: $1.03222 1000+: $0.99536 | |
 HSB06-181810Heat Sinks | CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM | 1980 | 1+: $0.81284 10+: $0.76204 100+: $0.71124 1000+: $0.68584 | |
 HSB20-353525Heat Sinks | CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM | 560 | 1+: $1.56348 10+: $1.51136 100+: $1.35502 1000+: $1.32896 | |
 HSB02-101007Heat Sinks | CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM | 3079 | 1+: $0.54256 10+: $0.51066 100+: $0.46278 1000+: $0.44682 | |
 HSB19-272718Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM | 518 | 1+: $1.54004 10+: $1.44380 100+: $1.34754 1000+: $1.29942 | |
 HSS10-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 29. | 1675 | 1+: $0.72800 10+: $0.68518 100+: $0.62095 1000+: $0.59954 | |
 HSB07-202009Heat Sinks | CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM | 3 | 1+: $0.68164 10+: $0.64156 100+: $0.58141 1000+: $0.56136 | |
 HSS12-B20-P95Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 19 | 재고 | 1+: $0.87264 | |
 114992731Heat Sinks | Seeed | ALUMINUM HEATSINK WITH FAN FOR J | 103 | 1+: $22.38000 | |
 IW-HSKALU-CLASLR-SC04Heat Sinks | iWave Systems | I.MX 8MPLUS SMARC SOM HEATSINK | 50 | 1+: $29.40000 | |
 IW-HSKALU-CLASLR-SB04Heat Sinks | iWave Systems | I.MX 8MMINI SBC HEATSINK | 3 | 1+: $30.00000 | |
 IW-HSKALU-CLASLR-Q70BHeat Sinks | iWave Systems | I.MX 8MMINI/NANO UQ7 HEATSINK | 2 | 1+: $23.20000 | |
 IW-HSKALU-CLASLR-SS05Heat Sinks | iWave Systems | I.MX 8MMINI/NANO SODIMM HEATSINK | 150 | 1+: $23.20000 |
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