


Winbond Electronics Corporation
W25Q64JVSSIQ
774-W25Q64JVSSIQ
PDF 데이터시트
IC FLASH 64MBIT SPI/QUAD 8SOIC
28 Weeks
왜 우리를 선택해야 합니까?
전문 플랫폼
B2B 및 B2C 구매초고속 배송
1-2일 이내 배송다양한 종류
정품 제조업체365일 보증
책임 있는 품질기술 사양
제조업체
Winbond Electronics
시리즈
SpiFlash®
Packaging
Tube
Part Status
Active
메모리 유형
Non-Volatile
메모리 포맷
FLASH
기술
FLASH - NOR
메모리 크기
64Mbit
FAQ
What package or case is W25Q64JVSSIQ available in?
W25Q64JVSSIQ is packaged in an 8-SOIC (also called SOP-8, 208-mil, 5.30mm width) surface-mount case.
Key details
Package: 8-SOIC (SOIC-8, SOP8)
Width: 5.30 mm (0.209 in, 208-mil)
Dimensions: ~5.28 × 5.28 × 1.8 mm
Mounting: Surface-mount (SMT)
Pin count: 8 pins
Other available packages for the W25Q64JV series
8-pad WSON (6×5 mm / 8×6 mm)
16-pin SOIC (300-mil)
8-pad XSON (4×4 mm)
24-ball TFBGA (8×6 mm)
12-ball WLCSP
What operating temperature range does W25Q64JVSSIQ support?
What is the standard lead time for W25Q64JVSSIQ?
Does W25Q64JVSSIQ have quantity-based pricing?





.png)



















.png?x-oss-process=image/format,webp/resize,h_32)










