Qualification of AIZU as an additional Wafer Fab Site option for select devices in F05 and HPA07 Technology (PDF) Product Change Notification (PDF) Qualification of Cu Wire as an Alternate Material Set for Assembly on Select Devices in the QFP and TSSOP Package Family (PDF)
Interfacing the TMS320F2833x to the AIC23B Stereo Audio Codec Migrating from TMS320x281x to TMS320x2833x or 2823x (Rev. B)