TI - PCN - 8-5-10 (PDF) Qualification of ASESH, TITL and JCAP as Additional Assembly / Test Site for Select Devices (PDF) Add Cu as Alternative Wire Base Metal for Selected Devices on SOT23 (DBV) and VSSOP (DGK, DGS, DGQ) packages (PDF)
THS4500IDGN Symbol & Footprint by SnapMagic
THS4500 TINA-TI Reference Design
THS4500 TINA-TI Spice Model THS4500 PSpice Model (Rev. A)