Process Change Notification (PDF) Qualification of Mold Compound 4211471 and Mount Compound 4211470 for Select Devices Assembled in TI-Malaysia and TI-Taiwan using TSSOP package (PDF) Process Change notification (PDF)
SN74LVC74AQPWREP Symbol & Footprint by SnapMagic
Logic Guide (Rev. AB) Little Logic Guide 2018 (Rev. G)