Qualification of Alternate Material Set for Assembly with Au Wire and Cu as Additional Wire Base Metal Option for Select SOIC and SSOP Package Devices (PDF) Product Change Notification (PDF)
SN65MLVD203D Symbol & Footprint by SnapMagic
Interface Communication Solutions Selection Guide
Wired-Logic Signaling with M-LVDS Interoperability of M-LVDS and BusLVDS M-LVDS Signaling Rate Versus Distance TIA/EIA-485 and M-LVDS Power and Speed Comparison