Qualification of Vanguard Facility as an additional FAB site source for select OPA340xx and OPA2336xx (PDF) Qualification of Alternate Material Set for Assembly with Au Wire and Cu as Additional Wire Base Metal Option for Select SOIC and SSOP Package Devices (PDF) Qualification of Vanguard Facility as an additional FAB site source for select OPA340xx and OPA2336xx devices in the 0.60UM process technology (PDF) Product Change Notification (PDF)
OPA2336UA Symbol & Footprint by SnapMagic
OPA336 TINA-TI Reference Design (Rev. A) OPA336 TINA-TI Reference Design (Rev. B)
OPA336 PSpice Model (Rev. B) OPA336 TINA-TI Spice Model (Rev. A) OPA336 PSpice Model (Rev. C) OPA336 TINA-TI Spice Model (Rev. B) OPA336 PSpice Model (Rev. A)