다음에 대한 데이터시트 및 제조업체 문서를 다운로드하세요. LP2988IM-5.0/NOPB
Mechanical Outline Drawing Function Diagram
Process Change Notification (PDF) Qualification of SID# 101380756 Mold Compound for Select SOIC Device(s) (PDF) Alternate Laser Marking Process Sequence for SOIC package (PDF) Add Cu as Alternative Wire Base Metal for Selected Device(s) (PDF) Process Change notification (PDF)