Qualification of SID# 101380756 Mold Compound for Select SOIC Device(s) (PDF) Process change notification (PDF) Alternate Laser Marking Process Sequence for SOIC package (PDF)
LMC6462BIM/NOPB Symbol & Footprint by SnapMagic
LMC6462 TINA-TI Reference Design
LMC6462 PSPICE Model (Rev. A) LMC6462 TINA-TI Spice Model