Micron Technology

N25Q128A13ESE40F

A: The N25Q128A13ESE40F provides high-speed data access and versatile interface options to meet a wide range of embedded system performance requirements. The table below summarizes its key technical specifications: Parameter Value Memory Density 128 Mbit (16 Mbytes) Technology NOR Flash, 65nm Supply Voltage 2.7V ~ 3.6V Max Clock Frequency 108 MHz (SPI mode) Equivalent Throughput Up to 432 MHz (Quad I/O) Max Access Time 7 ns Supply Current (Active) 20 mA (max) Standby Current < 100 μA Page Size 256 bytes Operating Temperature –40°C to +85°C Package 8‑pin SOIC (5.49 × 5.49 mm) Package Weight 53.65 mg (average) RoHS Status RoHS 3 Compliant / Lead‑Free Micron's innovative dual‑input/output and quad‑input/output SPI protocols enable double or quadruple the transfer bandwidth for both read and program operations, significantly improving system performance without increasing pin count.

A: The N25Q128A13ESE40F offers a flexible and extensive set of interface modes and advanced features to support diverse embedded applications: Multi‑Protocol SPI Support: The device can operate in three different protocols: Extended SPI (standard), Dual I/O SPI (DIO-SPI), and Quad I/O SPI (QIO-SPI). In Quad I/O mode, the effective data throughput reaches up to 432 MHz. Execute‑in‑Place (XIP) Mode: The device features XIP functionality, allowing the host processor to execute code directly from the flash memory without having to copy it into RAM first. The XIP mode is available for all three protocols (Extended, Dual I/O, and Quad I/O SPI) and can be configured via volatile or non‑volatile registers, or can even operate in XIP mode directly after power‑on. Memory Organization: The memory is organized as 256 main sectors of 64KB each, which are further subdivided into 16 subsectors each, resulting in a total of 4,096 subsectors of 4KB each. This flexible architecture allows both subsector erase (4KB) and sector erase (64KB) for efficient memory management. Program/Erase Suspend and Resume: The device supports dedicated PROGRAM/ERASE SUSPEND and RESUME instructions, allowing the system to pause an ongoing erase or program cycle to execute higher‑priority tasks, then resume the operation later. Software Reset: A software reset feature is available, enabling the device to be returned to a known state without a power cycle, improving system robustness. Continuous Read: The entire memory can be read via a single command, supporting fast read, quad or dual output fast read, and quad or dual I/O fast read operations. The number of dummy cycles and output buffer configuration are both adjustable to flexibly fit application requirements. Write Protection: The memory can be write‑protected by software using both volatile and non‑volatile protection features, applicable to every 64KB sector. Additional hardware write protection is also supported, with the protected area size defined by five non‑volatile bits (BP0, BP1, BP2, BP3, and TB). Security and Identification: The device includes a 64‑byte user‑lockable One‑Time Programmable (OTP) dedicated area that can be read and programmed using READ OTP and PROGRAM OTP commands, and these 64 bytes can be permanently locked. It also features an electronic signature with a JEDEC‑standard 2‑byte signature (BA18h) and a unique ID code (UID) consisting of 17 read‑only bytes, including two additional extended device ID (EDID) bytes for device identification.

A: The device is designed for long‑term reliability in embedded applications. It is rated for a minimum of 100,000 program/erase cycles per sector, ensuring long‑term durability for applications that require frequent firmware updates or data logging. Additionally, the device guarantees a minimum data retention period of 20 years, meaning stored information remains intact and reliable over an extended operational lifespan. Important Lifecycle Information: The part status of the N25Q128A13ESE40F is inconsistent across distributor databases. DigiKey lists the part as "Obsolete" (no longer manufactured). However, other sources, including Findic, list it as "Active." Several distributor pages also indicate a lifecycle status of "Active" or do not specify an obsolete status. The manufacturer (Micron) provides multiple Active lifecycle‑coded variants, including the N25Q128A13ESE40E, N25Q128A13ESE40F, and N25Q128A13ESE40G, all showing as Active As Of April 2025, indicating the device family remains in active production. Customers should consult the latest manufacturer datasheets or contact an authorized distributor to confirm the most current lifecycle status before integrating this device into new designs, as other sources may have conflicting information.

A: Thanks to its 128Mb density, high‑speed Quad I/O performance, industrial temperature range, and robust feature set, the N25Q128A13ESE40F is well‑suited for a wide range of applications, including embedded systems, automotive electronics, consumer electronics, and industrial control systems. It is ideal for firmware storage, boot code storage, configuration parameters, data logging, and code shadowing in systems where direct code execution from flash is beneficial. Alternative Replacement Parts: For new designs or replacement requirements, the following devices offer similar functionality and are recommended as potential substitutes: W25Q128JV by Winbond S25FL128S by Cypress (Infineon) MX25L12835F by Macronix These alternatives have comparable specifications and can serve as drop‑in replacements in many applications. Engineering should always verify compatibility with specific application requirements before design adoption. Alternate Packaging Options: Micron also offers the N25Q128A13ESE40F part in a Tape & Reel packaging variant for automated assembly, with a standard pack quantity of 1,500 pieces per reel, available under the orderable part number N25Q128A13ESE40F‑TR.