Micron Technology

MT29C4G96MAAHBACKD-5 WT

The “-5” speed bin defines the LPDDR2 DRAM timing. It corresponds to a minimum clock cycle time of 5 ns, yielding a 200 MHz clock frequency and a data rate of 400 Mbps per pin. The NAND Flash operates with standard asynchronous timing (minimum tRC of 25 ns) and its program/erase performance follows SLC NAND specifications.

“WT” stands for Wireless Temperature. The device is fully rated for reliable operation over an ambient temperature range of –25°C to +85°C. This grade targets mobile, portable, and outdoor wireless‑infrastructure applications that require extended consumer‑grade thermal margins but not the full industrial –40°C low‑end limit.

The MCP is assembled in a lead‑free, RoHS‑compliant VFBGA package (the specific ball count is designated by the “HBACKD” package code). Decoding the suffix: -5 = 200 MHz (5 ns) LPDDR2 speed grade, W = Wireless Temperature range (–25°C to +85°C), T = Tray packing. The components are delivered in dry‑pack trays and sealed in a moisture‑barrier bag with desiccant to meet the required moisture sensitivity level (MSL) prior to board assembly.