Macronix

MX25L25645GM2I-08G

A: The MX25L25645GM2I-08G offers a balance of high density, high speed, and low power consumption. The table below summarises its core specifications, drawn directly from the manufacturer datasheet and multiple distributor sources: Specification Value Memory Density 256 Mbit (32 Mbyte) Memory Organization 32M × 8 bits (32,554,432 × 8) Memory Technology Serial NOR Flash Memory Interface SPI (Single, Dual, Quad I/O, QPI) Max Clock Frequency 120 MHz Equivalent Quad I/O Rate Up to 480 MHz (120 MHz × 4) Write Cycle Time – Word, Page 30 µs (word), 750 µs (page) Supply Voltage (VCC) 2.7V to 3.6V (3.0V / 3.3V nominal) Active Read Current 20 mA (max) Standby Current (Idle) 20 µA (typical) Deep Power‑Down Current <5 µA Page Size 256 bytes Erase Granularity 4KB sector, 32KB/64KB block, full chip erase Endurance 100,000 program/erase cycles (minimum) Data Retention 20 years (minimum) Operating Temperature (Industrial) –40°C to +85°C Package Type 8‑pin SOP (SOIC‑8, 208‑mil) Moisture Sensitivity Level (MSL) 3 (168 hours) RoHS Status ROHS3 Compliant Additional features include: Hardware and Software Write Protection – Configurable block protection via status register bits, write enable latch (WEL), and write protect (/WP) pin. Erase/Program Suspend & Resume – Allows the host to interrupt long erase or program operations to handle higher‑priority tasks without resetting the device. Security Features – Includes a 1K‑bit secure OTP (One‑Time Programmable) region for storing unique device identification or security data. MXSMIO™ Architecture – Supports Single I/O (1‑bit), Dual I/O (2‑bit), Quad I/O (4‑bit), and QPI (Quad Peripheral Interface) modes for flexible performance scaling. XIP (Execute‑In‑Place) Support – Code can be executed directly from the flash memory without copying it to RAM first.

A: The device uses a standard 4‑wire Serial Peripheral Interface (SPI) bus for communication, operating in either SPI Mode 0 (CPOL=0, CPHA=0) or Mode 3 (CPOL=1, CPHA=1) for maximum compatibility with a wide range of microcontrollers and SoCs. The interface consists of the following signals: Pin Signal Group Function /CS (Chip Select) Enables the device when driven low CLK (Serial Clock) Provides the clock signal for data transfer (up to 120 MHz) SI / IO0 (Serial Data Input) Transmits data from the host to the device SO / IO1 (Serial Data Output) Transmits data from the device to the host WP / IO2 (Write Protect) Hardware write protection for the memory array HOLD / IO3 Pauses an ongoing serial communication without resetting the ongoing instruction The device supports multiple flexible interface modes: Standard SPI (Single I/O) : Uses SI (data in) and SO (data out) pins for 1‑bit transfers. Dual SPI (Dual I/O) : The SI and SO pins become bidirectional I/O pins (IO0 and IO1) for 2‑bit per cycle transfers. Quad SPI (Quad I/O) : All four I/O pins (IO0, IO1, IO2, IO3) are used for simultaneous data transfer, achieving 4‑bit per cycle throughput — equivalent to a 480 MHz effective data rate when operating at 120 MHz. QPI (Quad Peripheral Interface) : The device operates entirely in 4‑bit mode, further reducing command overhead. The Continuous Read Mode enables efficient memory access, allowing the host to execute code directly from the flash without copying to RAM first (Execute‑In‑Place, XIP).

A: The MX25L25645GM2I-08G is engineered for long‑term reliability in demanding embedded applications. Key specifications include: Reliability Parameter Specification Program/Erase Endurance 100,000 cycles per sector (minimum) Data Retention 20 years (minimum) Write Cycle Time – Word, Page 30 μs (word), 750 μs (page) Operating Temperature –40°C to +85°C (industrial grade) Standby Current 20 μA (typical) Deep Power‑Down Current <5 μA These reliability figures meet industry‑standard requirements for NOR Flash technology. The device also includes hardware and software write protection features, a write enable latch (WEL) , and security features including a 1K‑bit Secure OTP (One‑Time Programmable) region, ensuring data integrity in mission‑critical systems.

A: The MX25L25645GM2I-08G is well‑suited for a wide range of embedded applications requiring reliable, high‑density code and data storage with a simple, low‑pin‑count interface. Typical applications include: Firmware and boot code storage – Bootloaders, BIOS, firmware, and application code in embedded systems, supporting IAP (In‑Application Programming) and OTA (Over‑The‑Air) upgrades. Execute‑In‑Place (XIP) operation – Allows the host to run code directly from the Quad SPI flash without copying it to RAM first, reducing system memory requirements. Industrial control systems – PLCs, HMIs, data loggers, and factory automation equipment. Internet of Things (IoT) devices – Wi‑Fi modules, Bluetooth modules, smart home controllers, and sensor nodes. Consumer electronics – Smart TVs, set‑top boxes, digital cameras, gaming consoles, and smart speakers. Automotive electronics – Infotainment systems, navigation units, and OBD diagnostic devices (standard industrial grade). Medical devices – Diagnostic equipment and patient monitors. ⚠️ Important Lifecycle Information: The product lifecycle status for the MX25L25645GM2I-08G is Active. Multiple major distributors and manufacturer-affiliated sources confirm the Part Status as Active: DigiKey lists the Part Status as Active and DigiKey Programmable Verified, with a manufacturer standard lead time of 92 units per tube (standard packaging) and over 19,000 units in stock. AVAQ lists the Product Status as Active and the Programmabe status as Verified. JAK Electronics and Bonchip both list the Part Status as Active. OEM component database lists the Part Life Cycle Code as Active. For new designs requiring a 256Mb Serial NOR Flash with Quad I/O capabilities and industrial temperature range, the MX25L25645GM2I-08G remains an active, suitable choice. However, engineers are advised to verify current availability, pricing, and lead times directly with an authorised Macronix distributor (such as DigiKey, Mouser, Farnell, or Arrow) before committing the part to a new high‑volume design. The device is available in Tube packaging and Tape & Reel options, with a standard manufacturer package quantity of 92 units per tube and 2000 units per reel.