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메모리 - 모듈
(55 결과)메모리 모듈 제품군 내의 제품은 일반 컴퓨터 장비, 단일 보드 컴퓨터 및 표준화된 메모리 모듈을 수용할 수 있는 유사한 장치에 사용하기 위한 표준화된 물리적 모듈 형식을 갖춘 솔리드 스테이트 데이터 저장 장치입니다. 비휘발성(플래시, NVRAM) 및 휘발성(SDRAM) 메모리 기술을 기반으로 하는 장치가 포함됩니다.
| 부분 # | 제조업체 | 설명 | 유효성 | 가격 | 수량 |
|---|---|---|---|---|---|
 RAM-SD4-R-08Memory - Modules | ADLINK Technology | Memory Modules 2GB DDR2 667MHz SODIMM Non-ECC | 재고 | - | |
 PXI-7921Memory - Modules | ADLINK Technology | Other Modules 24CH 2-Wire Multiplexer Module | 재고 | - | |
DDR3 1333 204P 4GBMemory - Modules | ADLINK Technology | Memory Modules DDR3-1333, 4GB, 512Mx64, SO-DIMM 204P, 1.5V, Rank:2, CL9, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(256Mx8) | 재고 | - | |
DDR4 3200 4GB NON-ECC SO-DIMM INDUSMemory - Modules | ADLINK Technology | Memory Modules DDR4-3200, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:-40-85, Fix Die:Yes(C-die), Samsung Chip(512Mx16), Anti-sulfur | 재고 | - | |
8G SOD DDR4 2400 DDR4 SDRAMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2400, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:2, CL17, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8) | 재고 | - | |
DDR4 2666 260P 4GB NON-ECC SO-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(512Mx8) | 재고 | - | |
 PCI-8134AMemory - Modules | ADLINK Technology | Other Modules 4-AXIS MOTION CONTROLLER | 1 | - | |
DDR5 4800 262P 16GB ECC SO-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR5-4800, 16GB, 2Gx72, SO-DIMM 262P, 1.1V, Rank:1, CL40, ECC, OP Temp:0-95, Fix Die:Yes(B-die), Samsung Chip(2Gx8) | 재고 | - | |
DDR4 2666 4GB SO-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(512Mx16) | 재고 | - | |
 PCI-8102Memory - Modules | ADLINK Technology | Other Modules ADVANCED 2-AXIS MOTION CONTROLLER | 재고 | - | |
INNODISK DDR4 260P 3200MHZ 8GMemory - Modules | ADLINK Technology | Memory Modules DDR4-3200, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(1Gx8) | 재고 | - | |
DDR4 2400 8GB SO-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2400, 8GB, 1Gx64, SO-DIMM 260P, 1.2V, Rank:1, CL17, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(1Gx8) | 재고 | - | |
DDR3L 1600 204P 2GB SODIMMMemory - Modules | ADLINK Technology | Memory Modules DDR3L-1600, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(256Mx16) | 재고 | - | |
 ADI-BSEC/8MB W/ CCTALKMemory - Modules | ADLINK Technology | Other Modules ADi-BSEC/8MB W/ CCTalkInterface: PCIe x1Intrusion sensor x8COM:x3CCTALK:x1 | 재고 | - | |
DDR5-4800 32GB U-DIMM 288PMemory - Modules | ADLINK Technology | Memory Modules DDR5-4800, 32GB, 4Gx64, U-DIMM 288P, 1.1V, Rank:2, CL40, Non-ECC, OP Temp:0-95, Fix Die:No, Chip(2Gx8) | 재고 | - | |
DDR3L 1600 204P 4GB NON-ECC SODIMMMemory - Modules | ADLINK Technology | Memory Modules DDR3-1600, 4GB, 512Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(512Mx8x8), Height:30.0mm | 재고 | - | |
DDR4 2400 288P 8GB REG-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2400, 8GB, 1Gx72, R-DIMM 288P, 1.2V, Rank:1, CL17, ECC, OP Temp:0-85, Fix Die:Yes(C-die), Samsung Chip(1Gx8) | 재고 | - | |
DDR5 4800 32GB ECC SO-DIMM INDUSMemory - Modules | ADLINK Technology | Memory Modules DDR5-4800, 32GB, 2Gx72, SO-DIMM 262P, 1.1V, Rank:2, ECC, OP Temp:-40-95, Samsung Chip(2Gx8) | 재고 | - | |
DDR4 2666 288P 4GB U-DIMM NON-ECCMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 4GB, 512Mx64, U-DIMM 288P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(F-die), Samsung Chip(512Mx8) | 재고 | - | |
DDR4 2666 260P 32GB ECCMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 32GB, 4Gx72, SO-DIMM 260P, 1.2V, Rank:2, CL19, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(2Gx8) | 재고 | - | |
DDR4 2666 288P 16GB U-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 16GB, 2Gx64, U-DIMM 288P, 1.2V, Rank:2, CL19, Non-ECC, OP Temp:0-85, Fix Die:No(C-die), Samsung Chip(1Gx8) | 재고 | - | |
DDR4 3200 260P 4GB NON-ECC SODIMM INDUSMemory - Modules | ADLINK Technology | Memory Modules DDR4-3200, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL22, non-ECC, OP Temp:-40-85, Fix Die:No, Samsung Chip(512M x8*8 ), height:30mm | 재고 | - | |
DDR4 2666MHZ 260P 4GB SODIMMMemory - Modules | ADLINK Technology | Memory Modules DDR4-2666, 4GB, 512Mx64, SO-DIMM 260P, 1.2V, Rank:1, CL19, Non-ECC, OP Temp:0-85, Fix Die:No, Chip(512Mx8) | 재고 | - | |
DDR3 1333 204P 2GBMemory - Modules | ADLINK Technology | Memory Modules DDR3-1333, 2GB, 256Mx64, SO-DIMM 204P, 1.5V, Rank:1, CL9, Non-ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(256Mx8) | 재고 | - | |
DDR3L PC3-12800 2GB SO-DIMMMemory - Modules | ADLINK Technology | Memory Modules DDR3L PC3-12800, 2GB, 256Mx64, SO-DIMM 204P, 1.35V, Rank:1, CL11, Non-ECC, OP Temp:-40-85, Fix Die:No, Chip(256Mx16) | 재고 | - |
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